Wednesday, March 22, 2017

Bga Infrared Motherboard Repair Station

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G4H875-N G4H875-C G4H875-B - DFI-ITOX, LLC
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Reflow Soldering - Wikipedia
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) Heating may be accomplished by passing the assembly through a reflow oven or under an infrared lamp or by soldering individual joints with a hot air pencil. ... Read Article

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BIRD ANY CHIP IR 3000 “BETTER INFRARED DEVICE “ remove or repair packaged devices such as BGA, Mini BGA, SOP, PLCC, SMT, SMD , BIRD ® ANY CHIP IR3000 BGA Rework Station is totally controlled by smart panels of temperature. ... View Doc

Ball Grid Array - Wikipedia
A ball grid array (BGA) is a type of surface-mount packaging If a BGA is found to be badly soldered, it can be removed in a rework station, which is a jig fitted with infrared lamp (or hot air), The processor is affixed to the motherboard by soldering the balls to the motherboard. ... Read Article

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Bga Infrared Motherboard Repair Station

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Scotle IR6000 V3 - Electronic Repair Services
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Soldering - Wikipedia
It is often used to repair cast-iron objects, wrought-iron furniture, In particular ball grid array (BGA) devices are notoriously difficult, if not impossible, to rework by hand. Fiber focus infrared soldering Edit. ... Read Article

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